PURPOSE: To enhance a treating effect to the max. degree by the min. amount of a chemical liquid, in treating a semiconductive element with an etching liquid, by a method wherein parts to be treated by a new liquid and a recirculated liquid are separated and said semiconductive element is treated with the new liquid after treatment with the recirculated liquid as well as the latter treating liquid is recovered.

CONSTITUTION: A new liquid is supplied to an auxiliary liquid tank 16 for the new liquid from a new liquid tank 5 and the chemical liquid once used in treatment through a new liquid nozzle 20 is recovered by a treating liquid recovery plate 13 to be supplied to an auxiliary liquid tank 15 for a recirculated liquid. A semiconductive element 1 as a matter to be treated is treated with a used liquid during recirculation use in the first half and treated with the unused new liquid in the latter half. In this case, the semiconductive element is washed by water after the treatment with the new liquid is completed. Therefore, the new liquid supplied to the tank 16 from the tank 15 is certainly passed through the nozzle 20 and not flowed as a drain 23 without passing the nozzle as before. As the result, treatment can be carried out is good efficiency. In addition, because the final treatment is certainly carried out by the new liquid, the deterioration of reversible characteristics of the element 1 due to metal atom adhesion is eliminated.