Title:
MECHANOCHEMICAL POLISHING APPARATUS OF SEMICONDUCTOR WAFER, MOUNTING METHOD OF SEMICONDUCTOR-WAFER POLISHING PAD TO PLATEN OF ABOVE APPARATUS AND POLISHING COMPOSITE PAD OF ABOVE APPARATUS
Document Type and Number:
Japanese Patent JPH0697132
Kind Code:
A
Abstract:
PURPOSE: To provide an improved chemical mechanical polishing method, where trouble that two pads are suddenly separated off from each other is lessened in frequency of occurrence and slurry used for polishing is reduced in consumption in a polishing equipment. CONSTITUTION: A polishing equipment is equipped with a rotary platen 206 possessed of a surface, at least a polishing pad 208 (upper pad) possessed of a front surface which polishes a semiconductor wafer 220 and a rear surface which is bonded to the surface of the platen 206, and a bead 230 of gasket material which extends around the peripheral region of the polishing pad 208.
Inventors:
NIKORASU EFU PATSUSHIYU
Application Number:
JP19273693A
Publication Date:
April 08, 1994
Filing Date:
July 07, 1993
Export Citation:
Assignee:
LSI LOGIC CORP
International Classes:
B24B1/00; B24B13/01; B24B37/22; B24D9/08; B24D13/14; H01L21/304; (IPC1-7): H01L21/304; B24B1/00
Attorney, Agent or Firm:
Yutaka Yoshida (1 person outside)
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