Title:
MEDIUM PROCESSING DEVICE AND PRINTER
Document Type and Number:
Japanese Patent JP2016055294
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a medium processing device capable of improving position accuracy of a laser cut line with respect to a non-punching part formed by a die-cut part.SOLUTION: A medium processing device includes: a medium feeding part 4 which feeds a medium 100; a die-cut part 5 which forms a die-cut line 104 including a cut-line 104a for a non-punching part for forming the non-punching part 105a by performing a die-cut for the medium 100 on the medium 100; and a laser cut part 6 which is disposed on the downstream side rather than the die-cut part 5 and forms a laser cut line 107 on the medium by irradiating the medium 100 with laser in accordance with a die-cut position 106 formed of the die-cut line 104.SELECTED DRAWING: Figure 1
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Inventors:
KIMURA AKIRA
HOSOMI HIROAKI
HOSOMI HIROAKI
Application Number:
JP2014180968A
Publication Date:
April 21, 2016
Filing Date:
September 05, 2014
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B23K26/359; B23K26/00; B23K26/10; B26D9/00
Attorney, Agent or Firm:
Shinryo International Patent Office