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Title:
溶融加工性半晶質ブロックコポリイミド
Document Type and Number:
Japanese Patent JP4031241
Kind Code:
B2
Abstract:
Segmented, melt-processible, semicrystalline copolyimides are disclosed herein. These polymers are comprised of an amorphous or semicrystalline A segment (soft segment) and a semicrystalline B segment (hard segment), wherein the level of semicrystallinity in the A segment is less than that in the B segment. These copolyimides are semicrystalline and exhibit melting points in the range from about 330-395 DEG C In preferred embodiments, these copolyimides are end-capped and are crystallizable from their melts (i.e., they exhibit recoverable semicrystallinity). These copolyimides either inherently have suitably low melt visocosities to be melt-processible or can be made to have suitably low melt viscosities to be melt-processible by addition of certain additives Tailoring of the melting points and glass transition temperatures of these copolyimides can be effected by changing their molecular architecture.

Inventors:
John Earl Dodd
John A. Kreuz
Brian C. Ohman
Application Number:
JP2001390598A
Publication Date:
January 09, 2008
Filing Date:
December 21, 2001
Export Citation:
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Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C08G73/10; C08G73/14
Domestic Patent References:
JP4306232A
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe