To provide a melting device for recycling solder paste without emitting black smoke or malodor, because in conventional recycling methods of solder paste, solder paste in a state of including a flux component and an organic solvent is melted, the flux component and the organic solvent are burnt and carbonized resulting in generating black smoke or emitting malodor.
This melting device 20 is equipped with a solder tank 6 for melting solder alloy particles 3 by heating, a hood 21 covering the solder tank 6 and a nitrogen inlet 23 for infusing nitrogen to a place contiguous to the surfaces of molten solder alloy particles 3 in the solder tank 6. By infusing nitrogen, the solder alloy particles 3 are melted under the environment of lower oxygen concentration than air.
IKEDA YUICHI
KAJI MASATO
SUZUKI SHINICHI
| JPH0841509A | 1996-02-13 | |||
| JP2003053527A | 2003-02-26 |
Tadahiko Inaba
Kanako Murakami
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