Title:
溶融装置
Document Type and Number:
Japanese Patent JP5482846
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a melting device for recycling solder paste without emitting black smoke or malodor, because in conventional recycling methods of solder paste, solder paste in a state of including a flux component and an organic solvent is melted, the flux component and the organic solvent are burnt and carbonized resulting in generating black smoke or emitting malodor.SOLUTION: This melting device 20 is equipped with a solder tank 6 for melting solder alloy particles 3 by heating, a hood 21 covering the solder tank 6 and a nitrogen inlet 23 for infusing nitrogen to a place contiguous to the surfaces of molten solder alloy particles 3 in the solder tank 6. By infusing nitrogen, the solder alloy particles 3 are melted under the environment of lower oxygen concentration than air.
Inventors:
Kennori Iwaki
Hirokazu Ikeda
Kato Masato
Shinichi Suzuki
Hirokazu Ikeda
Kato Masato
Shinichi Suzuki
Application Number:
JP2012177257A
Publication Date:
May 07, 2014
Filing Date:
August 09, 2012
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K3/06; B23K35/40; C22B7/00; F27B17/00; F27D3/12; H05K3/34
Domestic Patent References:
| JP8041509A | ||||
| JP2003053527A | ||||
| JP11229048A | ||||
| JP2005186159A | ||||
| JP2001148567A | ||||
| JP2004311620A |
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Tadahiko Inaba
Kanako Murakami