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Title:
MEMBER AND METHOD FOR CLEANING OF PROBE TIP, AND TEST METHOD FOR SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP11087438
Kind Code:
A
Abstract:

To sufficiently remove a foreign matter from the tip of a probe for a semiconductor wafer test by a method wherein a cleaning member is constituted in such a way that a foreign matter removal film formed on the surface of a polising member which shaves off the foreign matter stuck to the tip of the probe when the tip of the probe is pierced.

A polishing member 40 is constituted of a mixed layer which is composed of a silicone rubber resin base material 41 which is elastic as a whole and of alumina fine power abrasives 42. A foreign matter removal film 43 is bonded to the surface of the polishing member 40, and a cleaning member 4 is constituted. Then, the foreign matter removal film 43 at the cleaning member 4 is pierced at a needle pressure which is lower than the needle pressure of the tip 20 of a probe 2 in a semiconductor wafer test, and a foreign matter 101 which is stuck to the tip 20 of the probe 2 is removed when the probe is pulled out from the polishing member 40. Thereby, it is possible to prevent the generation of a contact defect in which the foreign matter is restuck to a pad at an IC.


Inventors:
Mizuta, Masaharu
Application Number:
JP1997000238221
Publication Date:
March 30, 1999
Filing Date:
September 03, 1997
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G01R1/06; B24B19/00; B24D15/04; G01R31/28; H01L21/66; (IPC1-7): H01L21/66; G01R1/06; G01R31/28