Title:
MEMORANDUM PAD
Document Type and Number:
Japanese Patent JPH09277742
Kind Code:
A
Abstract:
To provide a low-priced and presentable high-grade memorandum pad.
A memorandum pad main body 3 is composed of a plural number of laminated memorandum slips 1 and also has a slotted insertion hole 11 through the main body 3. In addition, an adhesive 13 is applied to the inner wall of the insertion hole 11 to fasten the memorandum slips 1. The insertion hole 11 serves as a retaining hole for retaining an inserted writing instrument.
Inventors:
KISHI HIDEO
Application Number:
JP11302396A
Publication Date:
October 28, 1997
Filing Date:
April 11, 1996
Export Citation:
Assignee:
ART PROMOTION KK
International Classes:
B43K23/04; B42D5/00; (IPC1-7): B42D5/00; B43K23/04
Attorney, Agent or Firm:
斎藤 美晴
Previous Patent: FREE COVER FOR BOOK
Next Patent: DEVICE FOR PREVENTING INCORRECT COLLATING IN CALENDAR GATHERING MACHINE
Next Patent: DEVICE FOR PREVENTING INCORRECT COLLATING IN CALENDAR GATHERING MACHINE