Title:
METAL BOND WHEEL
Document Type and Number:
Japanese Patent JP2004291218
Kind Code:
A
Abstract:
To provide a high-strength Ni-Cu-Sn system metal bond wheel which cuts sharply, has rigidity and a long service life, and rust/free as well as deformation/free upon application of pressure.
The metal bond wheel is composed by bonding diamond abrasive grains and/or CBN abrasive grains by a metal bond, wherein the chemical composition of the metal bond is 40 to 70 wt% of Ni, 19 to 30 wt% of Sn, 1 to 7 wt% of Ag, and at least 5 wt% of Cu as the balance. Specifically, it is preferable that the diamond abrasive grains and/or the CBN abrasive grains are coated with titanium.
Inventors:
AOKI KIYOYUKI
CHAYAMA TATSUSHI
CHAYAMA TATSUSHI
Application Number:
JP2003091026A
Publication Date:
October 21, 2004
Filing Date:
March 28, 2003
Export Citation:
Assignee:
KURENOOTON KK
International Classes:
B24D3/06; B24D3/00; B24D3/08; (IPC1-7): B24D3/06; B24D3/00
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Nakamura Yoshiya
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Nakamura Yoshiya