Title:
金属セラミックス回路基板
Document Type and Number:
Japanese Patent JP4756200
Kind Code:
B2
Abstract:
A metal-ceramic circuit board is characterised by being constituted by bonding on a base plate (7) of aluminium or aluminium alloy at least one ceramic substrate board (2), wherein one surface of the ceramic substrate board (2) is bonded directly to the base plate (7), the other surface of the ceramic substrate board (2) has a metal conductive member (3) and the base plate (7) has a proof stress of not higher than 320 MPa and a thickness of not smaller than 1mm.
More Like This:
Inventors:
Hideyo Koyamauchi
Bath Masahiro
Bath Masahiro
Application Number:
JP2000267206A
Publication Date:
August 24, 2011
Filing Date:
September 04, 2000
Export Citation:
Assignee:
DOWA Metal Tech Co., Ltd.
International Classes:
C04B37/00; H05K1/05; H01B13/00; H01L23/14; H01L23/373; H01L25/07; H01L25/18; H05K3/00; H05K7/20; H05K1/03; H05K3/38
Domestic Patent References:
| JP7193358A | ||||
| JP7276035A | ||||
| JP9286681A | ||||
| JP11226717A | ||||
| JP8191120A | ||||
| JP10180433A | ||||
| JP4266087A |
Attorney, Agent or Firm:
Seiichi Sawaki