Title:
金属張積層板及び回路基板
Document Type and Number:
Japanese Patent JP7453432
Kind Code:
B2
Abstract:
To provide a metal-clad laminate capable of reducing a dimensional change to an environmental change during processes and time between the processes.SOLUTION: A metal-clad laminate includes an insulating resin layer and a metal layer, in which the insulating resin layer has a non-thermoplastic polyimide layer and a thermoplastic polyimide layer, and satisfies (i) a moisture absorptivity after moisture conditioning at 23°C, 50%RH and 4 hours after drying at 80°C for 1 hour of 1.0 wt.% or less; (ii) a difference between moisture absorptivities after moisture conditioning at 23°C, 50%RH and 1 hour and moisture conditioning for 2 hours of 0.2 wt.% or less; (iii) a value of in-plane birefringence of 2×10or less; (iv) variations in in-plane birefringence in the width direction of 4×10or less; and (v) the non-plastic polyimide having 20 pts.mol or more of a diamine residue that is represented by general formula (1) and is derived from a diamine compound to 100 pts.mol of the total diamine residue.SELECTED DRAWING: None
Inventors:
Kazuaki Kaneko
Toshio Ando
Shinichiro Sakurai
Toshio Ando
Shinichiro Sakurai
Application Number:
JP2023001860A
Publication Date:
March 19, 2024
Filing Date:
January 10, 2023
Export Citation:
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
B32B15/088; B32B7/023; B32B15/08; C08G73/10; H05K1/03
Domestic Patent References:
| JP2016188298A |
Attorney, Agent or Firm:
Kazuhiro Watanabe
Noboru Tajime
Keiko Tajime
Patent Attorney Corporation Taji International Patent Office
Noboru Tajime
Keiko Tajime
Patent Attorney Corporation Taji International Patent Office
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