To provide a metal-coated polyimide substrate, capable of providing COF for which peeling is not caused by a heat history for hardening a sealing resin, without forming a heterogeneous metal layer of nickel or the like on a copper plated surface, by controlling the layer thickness near final plating, to an appropriate thickness in the copper plating coating of a laminated structure formed into a desired thickness, by continuously executing plating.

For the metal-coated polyimide substrate, the copper plating coating is executed by a plurality of electrolytic cells on the surface of a metal layer formed on a polyimide film surface by a sputtering method, and tin plating coating is executed on the surface of the copper plating coating. When tin plating of a film thickness (t) is applied to the surface of the copper plating coating, electric copper plating is applied by the same electrolytic cell to an area from the copper plating surface layer, to at least a depth 3t.

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