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Title:
THE METAL COIL BUNDLING METHOD AND BUNDLING APPARATUS
Document Type and Number:
Japanese Patent JP2004010083
Kind Code:
A
Abstract:

To provide a metal coil bundling method and a bundling apparatus which is structured simply, and yet attaching a distinguishing mark on a metal coil when the coil has been bundled.

The bundling apparatus comprises a hoop guide 20, a required number of hoop bundling mechanisms 30, a label attachment mechanism 40 arranged integrally with at least one of the hoop bundling mechanisms 30, and a sensor 50 arranged in a prescribed position on the hoop guide 20 to detect the position of the head of a hoop H. When the hoop guide 20 is in a stand-by status, a portion of the hoop H with a prescribed length is fed to the hoop guide, and an identification label 4 is attached to the head of the fed hoop.


Inventors:
KATAOKA KATSUTO
Application Number:
JP2002164146A
Publication Date:
January 15, 2004
Filing Date:
June 05, 2002
Export Citation:
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Assignee:
DAIDO STEEL CO LTD
International Classes:
B65B13/04; B65B13/24; B65B27/06; B65C3/02; B65C9/18; B65C9/36; B65C9/42; (IPC1-7): B65B13/04; B65B13/24; B65B27/06; B65C3/02; B65C9/18; B65C9/36; B65C9/42
Attorney, Agent or Firm:
Taro Sosogi



 
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