Title:
METAL FILLER, SOLDER PASTE, AND CONNECTED STRUCTURE
Document Type and Number:
Japanese Patent JP2012250240
Kind Code:
A
Abstract:
To provide a metal filler which can be subjected to fusion joining in a reflow heat treatment condition of normal lead-free solder, is excellent in heat resistance after the fusion joining, and gives excellent joining strength at room temperature, even when an organic film treatment in the Cu surface of a substrate is performed.
The metal filler includes a mixture of first and second metal particles as principal ingredients, wherein in the mixture, the amount of second metal particles is 55-400 pts.mass based on 100 pts.mass of the first material particles, the first metal particle is a Cu particle or a Cu alloy particle, and the second metal particle contains Ag and Sn and is an Sn alloy particle whose content of the Ag is 0.3-4 mass%.
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Inventors:
KASHIWAGI TOSHINORI
SAITO TAKANORI
TANAKA NORIHITO
SAITO TAKANORI
TANAKA NORIHITO
Application Number:
JP2011122423A
Publication Date:
December 20, 2012
Filing Date:
May 31, 2011
Export Citation:
Assignee:
ASAHI KASEI E-MATERIALS CORP
International Classes:
B23K35/26; B23K1/00; B23K35/22; B23K35/30; C22C9/00; C22C9/02; C22C13/00; H01B1/00; H01B1/22; H01B5/00; H05K3/34; B23K101/42
Domestic Patent References:
| JP2009065008A | 2009-03-26 | |||
| JP2008243391A | 2008-10-09 | |||
| JPH0623582A | 1994-02-01 |
Foreign References:
| WO2011027659A1 | 2011-03-10 | |||
| WO2006109573A1 | 2006-10-19 |