Title:
金属膜形成方法および装置
Document Type and Number:
Japanese Patent JP5653743
Kind Code:
B2
Abstract:
A metal film-forming method is capable of forming a metal film on a surface of a base metal film, formed on a surface of a substrate, with sufficient adhesion to the base metal film even when a natural oxide film is formed on the surface of the base metal film. The metal film-forming method includes: preparing a substrate having a base metal film formed on a surface; and carrying out electroplating of the substrate using the base metal film as a cathode and another metal as an anode while immersing the substrate in a solution containing a metal complex and a reducing material, both dissolved in a solvent, to form a metal film, deriving from a metal contained in the metal complex, on the surface of the base metal film.
Inventors:
須崎 明
中田 勉
立石 秀樹
中田 勉
立石 秀樹
Application Number:
JP2010284120A
Publication Date:
January 14, 2015
Filing Date:
December 21, 2010
Export Citation:
Assignee:
株式会社荏原製作所
International Classes:
C25D3/38; C25D5/34; C25D7/00; H05K3/38
Attorney, Agent or Firm:
Isamu Watanabe
Kosugi Ryoji
Tetsuya Hirozawa
Kosugi Ryoji
Tetsuya Hirozawa