Title:
METAL FILM LAMINATE, MANUFACTURING METHOD THEREOF, AND METAL WIRING BOARD EMPLOYING THE SAME
Document Type and Number:
Japanese Patent JP2009170837
Kind Code:
A
Abstract:
To provide a metal film laminate which improves environmental resistance and is also available for a plating background film or the like by improving the adhesion of a metal film, formed on a substrate, with the substrate by applying a metal microparticle dispersed body onto the substrate and sintering it through heating treatment, manufacturing method thereof, and metal wiring board employing the same.
A metal film laminate is characterized in that a plurality of layers of metal oxide films each formed from an organic metal compound and metal films each formed from a metal microparticle dispersed body are laminated on a substrate and the first film to be formed on the substrate is a metal oxide film.
Inventors:
NOTOHARA YASUHIRO
YATSUNAMI RYUICHI
MIYANISHI SATORU
YATSUNAMI RYUICHI
MIYANISHI SATORU
Application Number:
JP2008010130A
Publication Date:
July 30, 2009
Filing Date:
January 21, 2008
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01L21/288; H01L21/3205
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano