Title:
METAL FILM AND METHOD FOR FORMING METAL FILM
Document Type and Number:
Japanese Patent JP2015042776
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metal film having a rough surface structure having a very large specific surface area and its suitable production method.SOLUTION: A metal film has a structure in which plate-like deposit bodies composed of a plated metal are superimposed in a mutually intersecting state. The metal film can be formed by adjusting amounts of additives added to a plating bath. Using an electrolytic copper plating bath as the plating bath, plate-like deposit bodies composed of copper can form a metal film which has an intersection superimposition structure and is composed of a copper plating film by adjusting the addition amount of polyacrylic acid added to the electrolytic copper plating bath.
Inventors:
ARAI SUSUMU
Application Number:
JP2013271076A
Publication Date:
March 05, 2015
Filing Date:
December 27, 2013
Export Citation:
Assignee:
UNIV SHINSHU
International Classes:
C25D13/10; C25D7/00; C25D15/02; H01M4/66
Domestic Patent References:
| JP2010238652A | 2010-10-21 | |||
| JP2010236072A | 2010-10-21 | |||
| JP2010103061A | 2010-05-06 | |||
| JP2012049107A | 2012-03-08 | |||
| JP2004156074A | 2004-06-03 | |||
| JP2007211305A | 2007-08-23 | |||
| JP2011058061A | 2011-03-24 |
Foreign References:
| US20020125983A1 | 2002-09-12 |
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