Title:
METAL FOIL WITH RESIN
Document Type and Number:
Japanese Patent JP3851749
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a resin solving the point at issue of conventional technique, excellent in handleability and storage stability in a semi-cured state and storage stability in a semi-cured state and having high heat resistance and excellent dielectric characteristics after curing.
SOLUTION: A metal foil with a resin has a resin layer on its surface. Herein, the resin layer is formed by semi-curing a layer comprising a composition consisting of a polycarbodiimide resin with a number average molecular weight of 3,000-50,000, an epoxy resin and a curing agent of an epoxy resin added if necessary and containing 20-200 parts by weight of the epoxy resin per 100 parts by weight of the polycarbodiimide resin.
More Like This:
| WO/2003/016046 | HULL COVERINGS |
Inventors:
Yasuo Imajo
Takahiko Ito
Hideji Tomita
Norimasa Nakamura
Takahiko Ito
Hideji Tomita
Norimasa Nakamura
Application Number:
JP35800799A
Publication Date:
November 29, 2006
Filing Date:
December 16, 1999
Export Citation:
Assignee:
Nisshinbo Corporation
International Classes:
B32B15/08; H05K1/03; B32B15/20; B32B27/34; B32B27/38; C08L63/00; C08L79/08; H05K3/46; (IPC1-7): B32B15/08; B32B15/20; C08L63/00; C08L79/08; //H05K1/03
Domestic Patent References:
| JP10326952A | ||||
| JP11121935A |
Attorney, Agent or Firm:
Masato Kobayashi