Title:
METAL MASK FOR PRINTING OF CREAM SOLDER
Document Type and Number:
Japanese Patent JPH0569685
Kind Code:
A
Abstract:
PURPOSE: To obtain a metal mask which enables a cream solder to be printed satisfactorily even on a printed circuit board with an uneven surface.
CONSTITUTION: A cream solder is printed on a shield substrate 2 using a metal mask for printing with an uneven surface corresponding to the projecting and recessed parts of the surface of the shield substrate 2 which is a printed circuit board.
Inventors:
MIYAZAWA HIROYASU
Application Number:
JP23339291A
Publication Date:
March 23, 1993
Filing Date:
September 12, 1991
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B41N1/24; H05K3/34; H05K1/00; H05K3/12; (IPC1-7): B41N1/24; H05K3/34
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)
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