Title:
METAL MOLD APPARATUS
Document Type and Number:
Japanese Patent JP2007149862
Kind Code:
A
Abstract:
To provide a metal mold apparatus which enables the miniaturization and reduction in the weight of a metal mold apparatus for taping a lead frame, and reduces work load on execution of metal mold replacement work.
Stepped faces 6 are formed on opposite faces of a pair of metal mold support stands 4, respectively, which metal mold support stands 4 are disposed across guide rails 1 that guide the transfer of a lead frame continuum. On the stepped faces 6, stepped faces 7 formed on the sides of a lower mold 5 are butted and supported. The whole of a press metal mold 2 including the lower mold 5 and an upper mold 8 can be assembled as capable of pulling out along the stepped faces 6 and 7.
Inventors:
Katayama, Masatoshi
Application Number:
JP2005000340700
Publication Date:
June 14, 2007
Filing Date:
November 25, 2005
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO LTD
International Classes:
H01L23/50; B21D43/02; B26F1/00; B29C65/02
