Title:
METAL MOLD FOR OUTER LEAD MOLDING
Document Type and Number:
Japanese Patent JP3160380
Kind Code:
B2
Abstract:
PURPOSE: To provide a metal mold for outer lead molding capable of bending all the outer leads in the same J-shape with bending rollers.
CONSTITUTION: A metal mold 10 for outer lead molding comprises a plurality of bending rollers 22a, 22b and 22c parallel installed for bending outer leads 18 in a J-shape when pushing the outer leads 18 of a semiconductor device 14, and a plurality of support pieces 23a, 23b, 24a, 24b, 24c and 24d for rotatably supporting a plurality of the bending rollers 22a, 22b and 22c in the metal mold 10. The support pieces 23a, 23b, 24a, 24b, 24c and 24d are installed in the position so as not to interfere with the outer leads 18 when pushing the outer leads 18 of the semiconductor device 14 to the bending rollers 22a, 22b and 22c.
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Inventors:
Minoru Harayama
Takashi Matsui
Takashi Matsui
Application Number:
JP22483392A
Publication Date:
April 25, 2001
Filing Date:
July 31, 1992
Export Citation:
Assignee:
Apic Yamada Co., Ltd.
International Classes:
B21D5/01; B23P13/02; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP6298655A | ||||
| JP3263861A | ||||
| JP3296251A |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)