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Patent Searching and Data


Title:
METAL MOLD FOR OUTER LEAD MOLDING
Document Type and Number:
Japanese Patent JP3160380
Kind Code:
B2
Abstract:

PURPOSE: To provide a metal mold for outer lead molding capable of bending all the outer leads in the same J-shape with bending rollers.
CONSTITUTION: A metal mold 10 for outer lead molding comprises a plurality of bending rollers 22a, 22b and 22c parallel installed for bending outer leads 18 in a J-shape when pushing the outer leads 18 of a semiconductor device 14, and a plurality of support pieces 23a, 23b, 24a, 24b, 24c and 24d for rotatably supporting a plurality of the bending rollers 22a, 22b and 22c in the metal mold 10. The support pieces 23a, 23b, 24a, 24b, 24c and 24d are installed in the position so as not to interfere with the outer leads 18 when pushing the outer leads 18 of the semiconductor device 14 to the bending rollers 22a, 22b and 22c.


Inventors:
Harayama, Minoru
Matsui, Takashi
Application Number:
JP1992000224833
Publication Date:
February 16, 2001
Filing Date:
July 31, 1992
Export Citation:
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Assignee:
APIC YAMADA KK
International Classes:
B21D5/01; B23P13/02; H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
綿貫 隆夫 (外1名)