METAL MOLD POLISHING DEVICE

Japanese Patent JPH01127273

A

PURPOSE:To uniformly polish in good accuracy a workpiece surface pressed in an equal pressure by a polishing material uniformly distributively adhering to the whole surface of a flexible film by utilizing a static water pressure in the water permeable flexible film and fixedly providing the flexible film to be extended in its periphery to the point end spread opening part of a polishing shaft so as to closely attach this flexible film to a metal mold shape. CONSTITUTION:Supplying grinding fluid generating static pressure uniformly in each part by permeable resistance of a water permeable flexible film 12 in the point end spread opening part of a polishing shaft 11, this flexible film 12 is extended in a spherical shape, and the polishing shaft 11 is rotated while closely attaching this flexible film 12 able to follow up the shape of a metal mold which is a workpiece. Simultaneously, the polishing shaft 11 is given press contact force with a metal mold surface by a fluid pressure applying means 15. In a condition that a fluid pressure by this fluid pressure applying means 15 balances with a static water pressure of the grinding fluid in the water permeable flexible film 12, moving a main unit 14 in a predetermined direction, the metal mold 1 performs surface polishing of its total surface high accurately in a uniform pressure. Here continually jetting the grinding fluid from inside this flexible film 12, a grinding chip is swept away by this grinding fluid, being prevented from staying between the flexible film 12 and the workpiece.

KODA SEIDO
NAGATSUKA HIDEKI

JP28156987A

May 19, 1989

November 06, 1987

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OSAKA KIKO CO LTD

B24B29/00; B24D9/08; B24D99/00; (IPC1-7): B24B29/00; B24D9/08

JPS6062469A	1985-04-10
JPS4721963A
JPS63109979A	1988-05-14

Shogo Ehara

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