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Patent Searching and Data


Title:
METAL MOLD SYSTEM FOR FORMING HOUSING OF COMPOUND INSULATOR
Document Type and Number:
Japanese Patent JPH11329127
Kind Code:
A
Abstract:

To lower a newly expended cost for a metal mold, and to permit simple reassembling.

In this metal mold system for a compound insulator composed of a core member, and a housing consisting of a barrel part and plural umbrellas around the core member, a metal mold 1 is formed by longitudinally coupling plural pairs of segments 2 having umbrella upper surface forming parts 3 on one main surfaces 2a and umbrella lower surface forming parts 4 on the other main surfaces 2b, such that the main surfaces of the adjacent segments 2 are facing each other. Here, parts 3-1 corresponding to umbrella tip parts 11 of the umbrella upper surface forming parts 3 forms crook portions of the umbrella tip parts 11. And, parts 4-1 corresponding to the umbrella tip parts 11 of the umbrella lower surface forming parts 4 are formed by planes identical with the main planes.


Inventors:
NAKAYAMA TETSUYA
Application Number:
JP13636598A
Publication Date:
November 30, 1999
Filing Date:
May 19, 1998
Export Citation:
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Assignee:
NGK INSULATORS LTD
International Classes:
H01B17/00; H01B19/00; (IPC1-7): H01B19/00; H01B17/00
Attorney, Agent or Firm:
Akihide Sugimura (8 outside)