Title:
METAL PARTICLE PASTE, CURED OBJECT USING THE SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015056238
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metal particle paste capable of obtaining a cured object in which deterioration is suppressed even under a high temperature environment.SOLUTION: The metal particle paste of the embodiment contains a polar solvent, and particles dispersed in the polar solvent and including first metal. In the polar solvent, second metal different from the first metal is dissolved.
Inventors:
HIRATSUKA DAISUKE
IGUCHI TOMOHIRO
UCHIDA MASAYUKI
IGUCHI TOMOHIRO
UCHIDA MASAYUKI
Application Number:
JP2013187709A
Publication Date:
March 23, 2015
Filing Date:
September 10, 2013
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01B1/22; B22F1/054; B22F1/107; B22F9/00; C09D5/24; C09D7/12; C09D201/00; H01B1/00; H01B5/14; H01L21/60; H01L23/12; H05K3/34
Domestic Patent References:
| JP2008069374A | 2008-03-27 | |||
| JP2009295965A | 2009-12-17 | |||
| JP2011034749A | 2011-02-17 |
Foreign References:
| WO2006011180A1 | 2006-02-02 | |||
| WO2006070747A1 | 2006-07-06 |
Attorney, Agent or Firm:
Masatoshi Kurata
Toshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Peak Takashi
Naoki Kono
Sunagawa 克
Iseki Mamoru 3
Takao Akaho
Tadashi Inoue
Tatsushi Sato
Okada Kishi
Mihoko Horiuchi
Toshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Peak Takashi
Naoki Kono
Sunagawa 克
Iseki Mamoru 3
Takao Akaho
Tadashi Inoue
Tatsushi Sato
Okada Kishi
Mihoko Horiuchi
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