Title:
METAL PARTICULATE, PLATING SOLUTION, LEAD WIRE AND RELATED METHOD
Document Type and Number:
Japanese Patent JP2010242136
Kind Code:
A
Abstract:
To provide a method for working various metals into desired shapes and forming coating films of various metals at a low temperature equal to or under a melting point of the metal, without impairing the electroconductivity and also without using a poisonous material such as a cyanide.
Plating or powder coating is performed by using metal particulates which are each covered with a monomolecular film of a chemical adsorption material having a reactive group on the outermost surface.
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
OGAWA KAZUFUMI
Application Number:
JP2009089903A
Publication Date:
October 28, 2010
Filing Date:
April 02, 2009
Export Citation:
Assignee:
OGAWA KAZUFUMI
International Classes:
C25D15/02; B05D1/18; B22F1/02; B22F9/00; B82B1/00; B82B3/00; C23C18/52; C23C24/00; C25D13/00; H01B5/00; H01B13/00; B22F1/00
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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