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Title:
METAL POLISHING LIQUID
Document Type and Number:
Japanese Patent JP2007214518
Kind Code:
A
Abstract:

To provide a metal polishing liquid for which the performances of high polishing speed and temporal stability are made compatible by modifying a colloidal silica surface and using an absorptive compound together on the surface.

The metal polishing liquid contains a formula (I) and colloidal silica, and at least a part of silicon atoms on the colloidal silica surface is substituted by aluminum atoms. In the formula (I), R1indicates an alkyl group, an alkynyl group, an alkenyl group, an allyl group or an aryl group; R2indicates a hydrogen atom, an alkyl group, an alkynyl group, an alkenyl group, an allyl group, or an aryl group; and m indicates an integer ≥0 and ≤6.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
YAMASHITA KATSUHIRO
Application Number:
JP2006035853A
Publication Date:
August 23, 2007
Filing Date:
February 13, 2006
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
JP2003197573A2003-07-11
JP2005277248A2005-10-06
JP2005159269A2005-06-16
JP2005183684A2005-07-07
JP2004123921A2004-04-22
Foreign References:
WO2002067309A12002-08-29
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda