Title:
METAL POLISHING MATERIAL COMPOSITION AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2004172606
Kind Code:
A
Abstract:
To provide a metal polishing material composition which can polish metal wiring at high speed when manufacturing semiconductor devices and can reduce the etching rate of the metal wiring.
This metal polishing material composition includes: (A) chelate resin particles having at least one functional group selected from among an aminocarboxylic acid group, an aminophosphonic acid group, and an iminodiacetic acid group; (B) inorganic particles; and (C) a surfactant having at least one functional group selected from among a carboxylic acid group, a sulfonic acid group, and a phosphate group.
Inventors:
MATSUMI YASUO
Application Number:
JP2003371968A
Publication Date:
June 17, 2004
Filing Date:
October 31, 2003
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
B24B37/00; B44C1/22; C09G1/02; C09K3/00; C09K3/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; C09K3/00; C09K3/14
Attorney, Agent or Firm:
Takashi Kuboyama
Toru Nakayama
Masayuki Enomoto
Toru Nakayama
Masayuki Enomoto