Title:
金属積層造形用金属粉及び該金属粉を用いて作製した造形物
Document Type and Number:
Japanese Patent JP6650531
Kind Code:
B2
Abstract:
A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, and Sm is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. An object of the present invention to provide a metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder.
Inventors:
Yoshitaka Shibuya
Kenji Sato
Kenji Sato
Application Number:
JP2018544956A
Publication Date:
February 19, 2020
Filing Date:
June 21, 2018
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
B22F1/05; B22F1/17; B22F3/105; B22F3/16; B33Y70/00; B33Y80/00
Domestic Patent References:
| JP2007211332A | ||||
| JP2015132001A | ||||
| JP2005194566A | ||||
| JP2015079728A |
Foreign References:
| WO2016181924A1 | ||||
| WO2017057341A1 | ||||
| WO2013118892A1 |
Attorney, Agent or Firm:
Ikki Kogoshi
Isamu Ogoshi
Isamu Ogoshi