Title:
METAL RECOVERY METHOD
Document Type and Number:
Japanese Patent JP2018123358
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metal recovery method which efficiently recovers metal of high purity from an integrated circuit package.SOLUTION: A metal recovery method which recovers metal from an integrated circuit package having a metal wire and a lead frame includes: a step of making the integrated circuit package carbonizes a resin component by heat treatment, and classifying the lead frame, and a residue containing the metal wire and a carbide; and a step of subjecting the classified residue containing the metal wire and the carbide to aqua regia treatment to obtain an aqua regia solution in which noble metal is dissolved in the aqua regia.SELECTED DRAWING: None
Inventors:
KOMORI YUJI
INOUE EIJI
INOUE NOBUHIRO
KONISHI MASAKAZU
INOUE EIJI
INOUE NOBUHIRO
KONISHI MASAKAZU
Application Number:
JP2017014705A
Publication Date:
August 09, 2018
Filing Date:
January 30, 2017
Export Citation:
Assignee:
ASTEC IRIE CO LTD
International Classes:
C22B7/00; C22B3/06; C22B3/46; C22B11/00; C22B13/00; C22B15/00; C22B19/20
Domestic Patent References:
| JPS5637699A | 1981-04-11 | |||
| JPH08148823A | 1996-06-07 | |||
| JP2013230437A | 2013-11-14 | |||
| JP2016160493A | 2016-09-05 | |||
| JPH0813051A | 1996-01-16 | |||
| JP2014510195A | 2014-04-24 | |||
| JP2013181181A | 2013-09-12 |
Attorney, Agent or Firm:
Patent Business Corporation Koei Patent Office