Title:
金属面の接合方法
Document Type and Number:
Japanese Patent JP4533254
Kind Code:
B2
Abstract:
It is an object of the present invention to provide means for forming a good bonded interface with a high process yield in the bonding of metal surfaces. Provided is a method of bonding metal surfaces together, and this method includes the steps of: forming a metal-added layer on one metal surface; forming a metal film, which is made of a metal of the same kind as the other metal surface or a metal capable of being alloyed with the other metal surface, as a layer above the metal-added layer; and performing large deformation, with the other metal surface brought into close contact with the metal film.
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| JPH0517249 | METHOD FOR JOINING CERAMICS TO METAL |
| WO/2001/087528 | WELDING SUPERALLOY ARTICLES |
| JP2636516 | INDUSTRIAL APPLICABILITY: Method for joining dissimilar metals |
Inventors:
Masaya Takahashi
Naoya Okada
Naoya Okada
Application Number:
JP2005180681A
Publication Date:
September 01, 2010
Filing Date:
June 21, 2005
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B23K20/00; B23K20/04; H01B13/00
Domestic Patent References:
| JP5212559A | ||||
| JP2003080377A | ||||
| JP63102115A | ||||
| JP4329221A |
Attorney, Agent or Firm:
Yusuke Hiraki