PURPOSE: To improve the corrosion preventiveness of a metallic material and the adhesive property to a resin substrate by treating the surface of the metallic material with a specified bistrialkoxysilyl compd.
CONSTITUTION: When copper foil is stuck to a resin substrate to form a copper laminated plate for a printed circuit, etc., the surface of the copper foil is treated with a liq. treating agent prepd. by diluting at least one kind of bistrialkoxysilyl compd. represented by the general formula (R1O)3SiR2Si(OR3)3 (where each of R1O and R3O is 1-8C alkoxy and R2 is a divalent org. group), e.g. (CH3O)3Si(CH2)2, Si(OCH3)3, (CH3O)3Si(CH2)3Si(OCH3)3 or (CH3O)3Si(CH2)4Si(OCH3)3 as an effective component to 0.001-10wt.% concn. with a solvent such as water, alcohol or acetone. The corrosion preventiveness of a metallic material such as the copper foil is improved and the adhesive property to the resin substrate is remarkably improved.
KUMAGAI MASASHI
OGINO YUKIO
