To provide a metalized composition capable of forming a conductive layer having a predetermined shape and size, even if it is a low-melting-point conductive material; and to provide a ceramic wiring board equipped with a conductive layer that uses it.

This metalized composition contains a low-melting-point metal such as Cu and a metal compound, such as WC; and when it is assumed that the total of the low-melting point metal and the metal compound is 100 vol.%, the content of the metal compound is 33-72 vol.%. This ceramic wiring board 1 comprises a ceramic part 11 (formed of alumina or the like) and a conductive layer 12 disposed on a surface thereof or in the inside thereof; and the conductive layer comprises a low-melting-point metal part (formed of Cu or the like) formed of a low-melting-point metal, having a melting point lower than the sintering temperature of a ceramic material constituting the ceramic part, and a metal compound junction part (formed of WC or the like), formed in the low-melting-point metal part and formed of a metal compound having a melting point higher than the sintering temperature of the ceramic material.