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Title:
METALLIC BASE SUBSTRATE
Document Type and Number:
Japanese Patent JPS6418295
Kind Code:
A
Abstract:

PURPOSE: To improve heat-conducting properties, machining characteristics such as bendability, a dimensional stability, heat-resistant properties and electric characteristics by a method wherein an insulating layer composed of an alumina paper impregnated with thermoplastic resin and a conductor layer are laminated and unified with a metal base.

CONSTITUTION: An insulating layer 3 composed of an alumina paper 1 and thermoplastic resin 2 is formed on a metal base 4 and, further, a conductor layer 5 is laminated on the insulating layer 3. The thermoplastic resin 2 is melted and softened by heat and impregnates the alumina paper 1 to form the insulating layer 3 and, at the same time, unifies the insulating layer 3 with the laminated metal base 4 and the conductor layer 5. With this constitution, a metallic base substrate with excellent heat-conducting properties, machining characteristics such as bendability, a dimensional stability, heat-resistant proper ties and electric characteristics can be obtained.


Inventors:
YANO ISAMU
HANI KIYOSHI
NISHIMOTO YOSHIO
MARUYAMA YOSHIHIRO
KIMURA MINORU
KOGURE NAOYUKI
Application Number:
JP17508787A
Publication Date:
January 23, 1989
Filing Date:
July 14, 1987
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K1/05; (IPC1-7): H05K1/05
Attorney, Agent or Firm:
Masuo Oiwa



 
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