To provide a metallic film-forming method and a metallic pattern-forming method capable of forming a metallic film or a metallic pattern having excellent adhesiveness to a smooth substrate without requiring much energy by a simple process, and a metallic film and a metallic pattern having excellent adhesiveness to the smooth substrate manufactured without using much energy in a simple process.
The metallic film-forming method comprises (a) a polymer layer-forming step of forming a polymer layer by directly performing the chemical coupling of polymer having a functional group interacting with a plating catalyst or its precursor, a polymerization group, and a substituent group including a divalent sulfur atom on a substrate, (b) a catalyst providing step of providing an electroless plating catalyst or its precursor to the polymer layer, and (c) a metallic film-forming step of forming a metallic film on the polymer layer by performing the electroless plating. There are provided a metallic film obtained therefrom, the metallic pattern-forming method applying the metallic film-forming method, and the metallic pattern obtained therefrom.
| JP2005272961A | 2005-10-06 | |||
| JP2005311268A | 2005-11-04 | |||
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| JP2005228879A | 2005-08-25 | |||
| JP2005264078A | 2005-09-29 |
| WO2003072851A1 | 2003-09-04 |
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda