Title:
METAL FOIL, METAL FOIL WITH RELEASE LAYER, LAMINATED BODY, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2017061720
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide metal foil which in a step of providing a release layer on metal foil and enabling physical peeling of a resin base material when the metal foil is stuck onto a resin base material, and thereby removing the metal foil from the resin base material, the metal foil is removed at good cost without impairing a profile of the surface of the metal foil transferred onto the surface of the resin base material, and resins having different resin components can be stuck to each other with good adhesiveness.SOLUTION: Metal foil has surface ruggedness having a ratio (Sz/Rsm) of a maximum height Sz to an average interval Rsm of 0.5-3.0 at least one surface.SELECTED DRAWING: Figure 1
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Inventors:
MORIYAMA AKIMASA
ISHII MASASHI
ISHII MASASHI
Application Number:
JP2015187530A
Publication Date:
March 30, 2017
Filing Date:
September 24, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D1/04; B32B9/00; B32B15/08; B32B15/20; C23C26/00; C25D5/16; H05K3/18; H05K3/38
Domestic Patent References:
| JP2013213250A | 2013-10-17 | |||
| JP2015042779A | 2015-03-05 | |||
| JP2015042785A | 2015-03-05 | |||
| JP2015183240A | 2015-10-22 | |||
| JP2015203038A | 2015-11-16 |
Foreign References:
| WO2014054811A1 | 2014-04-10 | |||
| KR20140094315A | 2014-07-30 | |||
| WO2014065431A1 | 2014-05-01 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
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