Title:
Metallic foil, metallic foil with a releasing layer, a layered product, a printed wired board, a semiconductor package, electronic equipment, and a manufacturing method of a printed wired board
Document Type and Number:
Japanese Patent JP6204430
Kind Code:
B2
Abstract:
Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damaging the surface profile of the metal foil transferred to the surface of the resin substrate, and also resins having different resin components can be adhered with good adhesion. A metal foil containing, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 μm.
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Inventors:
Akimasa Moriyama
Masashi Ishii
Masashi Ishii
Application Number:
JP2015187491A
Publication Date:
September 27, 2017
Filing Date:
September 24, 2015
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D1/04; B32B9/00; B32B15/08; B32B15/20; C25D1/22; C25D5/16; H05K3/38; H05K3/46
Domestic Patent References:
| JP7216586A | ||||
| JP2015183240A | ||||
| JP2013213250A | ||||
| JP2014135175A |
Foreign References:
| WO2016104420A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation