Title:
METALLIC MATERIAL FOR ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2015045047
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component having low whisker resistance, low adhesion abrasion characteristics, and high durability; and a connector terminal, a connector, and an electronic component using the same.SOLUTION: A metallic material for an electronic component includes: a base material; a lower layer formed on the base material and constituted by one, two, or more types selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co, and Cu; a middle layer formed on the lower layer; and an upper layer formed on the middle layer and constituted by an alloy including one or two types selected from a constituent element group B consisting of Sn and In, and one, two, or more types selected from a constituent element group C consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir. An XPS survey measurement of a surface of the upper layer satisfies I/(I+I)≥0.1, where Iis a zero-valent detection intensity, and Iis bivalent and tetrad detection intensity of photoelectron spectrum of 3d orbit of Sn.
Inventors:
FURUSAWA HIDEKI
Application Number:
JP2013176111A
Publication Date:
March 12, 2015
Filing Date:
August 27, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C23C28/00; C22C5/02; C22C5/04; C22C5/06; C22C9/00; C22C13/00; C22C19/03; C22C19/07; C22C22/00; C22C27/06; C22C28/00; C22C38/00; C25D5/10; C25D5/48; C25D5/50; C25D7/00; C25D9/00; H01B5/02; H01B13/00; H01L23/50; H01R13/03
Attorney, Agent or Firm:
Axis international patent business corporation