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Title:
METALLIC MATERIAL FOR ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2015045054
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component excellent in insertion force, solder wettability, and durability, as well as micro slide abrasion characteristic; and a connector terminal, a connector, and an electronic component using the same.SOLUTION: A metallic material for an electronic component includes: a base material; a lower layer formed on the base material and constituted by one, two, or more types selected from a constituent element group A consisting of Ni, Cr, Mn, Fe, Co, and Cu; a middle layer formed on the lower layer; an upper layer formed on the middle layer and constituted by an alloy including one or two types selected from a constituent element group B consisting of Sn and In, and one, two, or more types selected from a constituent element group C consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and further a processing layer formed on the upper layer. An XPS survey measurement indicates that, in the processing layer, the density of Au satisfies 0.5-10 at% in the metal constituted by one, two, or more types selected from the metal element groups constituting the lower layer, the middle layer, and the upper layer and in the elements of one or more types selected from the group consisting of O, C, S, P, and N.

Inventors:
FURUSAWA HIDEKI
SHIBUYA YOSHITAKA
Application Number:
JP2013176120A
Publication Date:
March 12, 2015
Filing Date:
August 27, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C23C28/00; C22C5/02; C22C5/04; C22C5/06; C22C9/00; C22C13/00; C22C19/03; C22C19/07; C22C22/00; C22C27/06; C22C28/00; C22C38/00; C25D5/12; C25D5/48; C25D5/50; C25D7/00; C25D9/06; C25D9/08; H01B5/02; H01B7/00; H01B7/08; H01B13/00; H01R13/03
Attorney, Agent or Firm:
Axis international patent business corporation