Title:
METALLIC MATERIAL FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING THE SAME, AND CONNECTOR TERMINAL, CONNECTOR AND ELECTRONIC COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2015045053
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metallic material for an electronic component having low contact resistance and a low friction coefficient, thus having reduced insertion, and having low whisker properties, low adhesion wear properties and having high durability, and a connector terminal, a connector and an electronic component using the same.SOLUTION: Provided is a metallic material for an electronic component comprising: a base material; a lower layer formed on the base material and composed of one or more kinds selected from an A constituent element group as a group consisting of N, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer; an upper layer formed on the intermediate layer and composed of one or two kinds selected from a B constituent element group as a group consisting of Sn and In and one or more kinds of alloys selected from a C constituent element group as a group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; and a surface-treated layer formed on the upper layer and including a metal(s) composed of one or more kinds selected from a metallic element group composing the lower layer, the intermediate layer and the upper layer. The intermediate layer includes the metal(s) in the B constituent element group by 35 at% or higher.
Inventors:
FURUSAWA HIDEKI
SHIBUYA YOSHITAKA
SHIBUYA YOSHITAKA
Application Number:
JP2013176118A
Publication Date:
March 12, 2015
Filing Date:
August 27, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D5/10; C22C5/02; C22C5/04; C22C5/06; C22C9/00; C22C13/00; C22C19/03; C22C19/07; C22C22/00; C22C27/06; C22C38/00; C23C22/58; C25D5/16; C25D5/48; C25D5/50; C25D7/00; C25D11/36; H01B5/02; H01B13/00
Attorney, Agent or Firm:
Axis international patent business corporation