Title:
METALLIC MATERIAL RECOVERY METHOD
Document Type and Number:
Japanese Patent JP2015178652
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To enable metallic material constituting wiring and an electrode and the like of a semiconductor chip having an element composed of a semiconductor to be more easily separated from the semiconductor chip and recovered.SOLUTION: There is provided a metallic material recovery method comprising: a step S101 of bringing a semiconductor chip having an element composed of a semiconductor into contact with mercury and dissolving the metal constituting the electrode and wiring of the semiconductor chip, in the mercury (first step); and a step S102 of separating the metal from the mercury in which the metal is dissolved (second step).
Inventors:
SAITO HIROYUKI
Application Number:
JP2014056003A
Publication Date:
October 08, 2015
Filing Date:
March 19, 2014
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
C22B11/10; B09B3/00; C22B21/00
Domestic Patent References:
| JP2006063381A | 2006-03-09 | |||
| JP2003247030A | 2003-09-05 | |||
| JPS5021404B1 | 1975-07-23 | |||
| JP2013230437A | 2013-11-14 |
Foreign References:
| US6294028B1 | 2001-09-25 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Yuzo Koike
Shigeki Yamakawa
Yuzo Koike