Title:
電子部品用金属材料及びその製造方法
Document Type and Number:
Japanese Patent JP5086485
Kind Code:
B1
Abstract:
There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 µm, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 µm.
Inventors:
Yoshitaka Shibuya
Kazuhiko Fukamachi
Atsushi Kodama
Kazuhiko Fukamachi
Atsushi Kodama
Application Number:
JP2012033265A
Publication Date:
November 28, 2012
Filing Date:
February 17, 2012
Export Citation:
Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
C23C30/00; B32B15/04; C22C5/02; C22C5/04; C22C5/06; C22C5/08; C22C5/10; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22C13/00; C22C13/02; C22C19/00; C22C22/00; C22C27/06; C22C28/00; C22C30/06; C22C38/00; C25D5/10; C25D7/00
Domestic Patent References:
| JP11229178A | ||||
| JP2011012320A | ||||
| JP1306574A | ||||
| JP11121075A | ||||
| JP4160200A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation