Title:
METALLIC PASTE FOR TRANSFER AND BUMP FORMATION
Document Type and Number:
Japanese Patent JP3565028
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to sufficiently secure the transfer volume also reduce the defective junction.
SOLUTION: A solder ball 5 is transfer-coated with a metallic paste 14 comprising a flux containing conductive metallic powder in excellent solder wettability and then this solder ball 5 coated with this metallic paste is shifted to an electrode of a work for heating thereby enabling the solder ball 5 to be junctioned with an electrode for the formation of the solder bump 5. In the bump formation process, the content of the metallic powder is specified to be within said range thereby enabling the transfer volume of the metallic paste 14 to be secured accordingly making it possible to feed sufficient metallic powder to the junction part for diminishing the developement of defective junction.
Inventors:
Ken Maeda
Tadahiko Sakai
Tadahiko Sakai
Application Number:
JP20156698A
Publication Date:
September 15, 2004
Filing Date:
July 16, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01B1/22; (IPC1-7): H01L21/60; H01B1/22
Domestic Patent References:
| JP8224663A | ||||
| JP9051050A | ||||
| JP9260836A | ||||
| JP5129374A | ||||
| JP11145192A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito