Title:
METALLIC WIRING STRUCTURE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH05206132
Kind Code:
A
Abstract:
PURPOSE: To suppress a disconnection phenomenon caused by a stress-migration which is the problem to be resolved urgently in an Al wiring structure used by an LSI technique.
CONSTITUTION: In a metallic wiring structure wherein a wiring metal having Al as its main constitutional element is given on SiO2, an amorphous Al2O3 film is formed between the wiring metal and SiO2. Thereby, an interface reaction indicated by the relation of 3SiO2+4Al → 3Si+2Al2O3 is suppressed. As a result, the contraction of the volume of wiring, which is caused by the interface reaction, i.e., a distortion in the wiring can be reduced, and the time elapsing until a disconnection is generated by a stress-migration can be made long.
Inventors:
MIURA YOSHINAO
HIROSE KAZUYUKI
HIROSE KAZUYUKI
Application Number:
JP3848492A
Publication Date:
August 13, 1993
Filing Date:
January 29, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L23/52; H01L21/3205; (IPC1-7): H01L21/3205
Attorney, Agent or Firm:
Sugano Naka