PURPOSE: To inexpensively metallize the surface of a substrate by forming a chemically active part on the surface of the substrate, bringing it into contact with a volatile organic metallic compound, decomposing this compound to form chemical species and utilizing this chemical species as seeds for electroless plating.
CONSTITUTION: A chemically active part AH having an operation in which, in the case it is brought into contact with the vapor of a volatile organic metallic compound, it decomposes this compound to form the chemical species of metallic components is formed on the surface of a substrate. Then, this active part AH is exposed to the vapor of a volatile organic metallic compound (e.g. bisallylpalladium) and is allowed to decompose the volatile organic metallic compound to form the chemical species M1 of metallic components (e.g. palladium), and this chemical species M1 are adhered to the surface of the substrate. Next, the adherent chemical species M1 of the metallic components are utilized as a seed material, and the surface is applied with electroless plating of metal M2 (e.g. copper), by which the surface of the substrate is metallized.
KIYARORIN AN KABUAKU
DEII YANGU JIYUNGU
JIEI MIINGU PAAKU
RICHIYAADO RONARUDO TOOMASU
| JPS5112333A | 1976-01-30 |