PURPOSE: To provide a new methallylphenol compound usable as a raw material for a resin composition having excellent moldability and giving a cured material having high heat-resistance by curing the resin composition.
CONSTITUTION: A compound of the formula I [X is S, SO2, O, group of the formula II or the formula III (R2 and R3 are H, alkyl, phenyl, trifluoromethyl or trichloromethyl); (m) is 0 or 1; R1 is H or methyl], e.g. bis [4-hydroxy-3,5- dimethallyl-phenyl]methane. The compound is easily producible by the Claisen rearrangement of a methallylphenyl ether of the formula IV in the presence of 0.01-10mol% of a base containing N atom in the molecule and soluble to the ether. The homopolymerization of the compound or copolymerization with other monomer gives a cured resin having excellent heat-resistance in high moldability. The compound is useful as a raw material component for the production of an electrical or electronic material for heat-resistant printed circuit board, etc., or the production of a heat-resistant filler, etc.
WASHIMI AKIRA
KIMURA KAORU