Title:
電気-伝導性基質の製造方法
Document Type and Number:
Japanese Patent JP2007532796
Kind Code:
A
Abstract:
The electro-conductive substrate of the present invention may comprise filaments extruded from a die orifice and at least one metal powder dispensed from a second orifice of the same die unit by way of a gas or liquid carrier. As the polymeric filament is extruded from the die, one or more metal powders may be simultaneously dispensed to coat the surface of the filament. As the polymeric melt and metal powder is extruded, air pressure is impinged upon the metal powder directing the powder toward the extruded filament. The metal powder adheres to the molten polymer as it is extruded for the die, coating the surface of the filament. The metal powder may also be incorporated into the polymeric melt prior to extrusion.
Inventors:
De Leon, Sergio Deias
Carter, nick
Carter, nick
Application Number:
JP2007508406A
Publication Date:
November 15, 2007
Filing Date:
April 12, 2005
Export Citation:
Assignee:
Polymer Group Incorporated
International Classes:
D01D5/08; B29C48/05; B29C48/08; B29C48/345; B29C70/88; D01D5/42; D01F1/09; D01F11/00; D01F11/04; D02G3/06; D02G3/36; D02G3/44; D03D1/00; D03D15/00; D04H1/46; D04H3/00; D04H3/16; D06M10/00; D06M10/02
Attorney, Agent or Firm:
Heikichi Odashima