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Title:
ポリアミドおよびポリアミド組成物の製造方法
Document Type and Number:
Japanese Patent JP3606783
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide which is excellent in mechanical strengths, low water absorption properties, and heat resistance and hardly stains a metal mold when injection molded, especially into precision parts. SOLUTION: This polyamide contains (A) 90-100 mol% repeating units derived from terephthalic acid and a linear or branched 4-12C aliphatic diamine, (B) 0-10 mol% repeating units derived from isophthalic acid and a 4-12C aliphatic diamine, (C) 0-10 mol% repeating units derived from a 4-18C aliphatic dicarboxylic acid and a 4-12C aliphahc diamzne, and (D) 0-10 mol% repeating units derived from a 6-20C lactam or aminocarboxylic acid and has a content of methanol-soluble components (measured after 3h immersion in methanol at 60 deg.C) of 0.5 wt.% or lower.

Inventors:
Masahiro Sawada
Kunihiro Ouchi
Application Number:
JP2000061846A
Publication Date:
January 05, 2005
Filing Date:
March 02, 2000
Export Citation:
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Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08J5/00; B29C45/00; C08G69/04; C08G69/26; C08K7/02; C08L23/26; C08L25/00; C08L51/00; C08L71/10; C08L77/00; (IPC1-7): C08G69/26; C08J5/00; C08K7/02
Domestic Patent References:
JP3066755A
JP1249857A
JP7228769A
JP7228771A
Foreign References:
WO1997015610A1
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura



 
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