To provide a method for adjusting alignment capable of accurately setting a substrate at an inspecting device even when there is dust on the substrate.
In this method, a substrate such as a color filter 2 is set at an inspecting device, and the substrate is moved relatively to a CCD line sensor. Then from image information of the CCD line sensor, the alignment of the substrate is adjusted for inspecting defects in the substrate. In this case, three groups of each of the edge locations 30 and 33 of two points separated at a predetermined interval from each other of the reference side 1 of the substrate along an edge 14 are detected by the above-mentioned CCD line sensor, and the median value of the angle of inclination obtained from the acquired data on the three groups is selected as the most provable value.
OGAWA TOSHIAKI
ENDO MAKOTO
SHIODA TOMOHIKO
