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Patent Searching and Data


Title:
METHOD FOR ALIGNING SUBSTRATE
Document Type and Number:
Japanese Patent JPH0327547
Kind Code:
A
Abstract:

PURPOSE: To shorten time required for alignment by a method wherein the center of a circular substrate is calculated from the distance of an assumed diameter line to rotate the substrate so that a formation angle and position of a notch are calculated from the intersections of an inner peripheral circle at specific positions and the notch.

CONSTITUTION: The reference center of a mount 5 for holding a circular substrate 6 is moved to reach the coordinate origin of a stage 4 side to be an assumed center wherein a plurality of assumed diameter lines passing through the assumed center are specified to detect an edge of the substrate 6 by a reflection sensor 9. Thus the distances of a plurality of the assumed diameter lines are measured to calculated the center of the substrate 6 based on the assumed diameter lines except the shortest assumed diameter line. Then the substrate 6 is transferred from the mount 5 onto pincettes 8 and after the center of the substrate 1 is aligned with the center of the mount 5, the substrate 1 is correctly adjusted to the center position transferred on the mount 5. Then the intersections of an inner peripheral face at specific positions in the substrate 6 and a notch for alignment are detected by a sensor 9 to calculate formation angle of the notch from the intersections to detect the position of the notch.


Inventors:
SUZUKI HIROSHI
Application Number:
JP16216189A
Publication Date:
February 05, 1991
Filing Date:
June 23, 1989
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/68; (IPC1-7): H01L21/68
Domestic Patent References:
JPS59147444A1984-08-23
JPS6132539A1986-02-15
JPH01303737A1989-12-07
Attorney, Agent or Firm:
Saichi Suyama (1 person outside)