METHOD AND APPARATUS FOR APPLYING HARD PARTICLE ON LINEAR STRUCTURE

Japanese Patent JPS58126019

A

An apparatus and a process are disclosed making it possible to mount, without disadvantages, relatively hard particles, such as diamond dust and the like, on wire-like base material in such a way that the diamond dust is not damaged, wherein any desired coating, that is, especially also a coating coherent over the length of the wire, can be produced. This coating is at least macroscopically homogeneous in character. In such a process for the application of relatively hard particles to a circular wire-like form or a wire-like form without longitudinal edges, for the purpose of producing a plain or multiple saw, the form is coated under pressure with the aid of a surface of two rolls. This surface is at least partially provided with the particles to be applied. The wire-like form is turned about its longitudinal axis during this process. The form must be present in the straight, that is stretched, condition. The process can be performed with an apparatus exhibiting two hardened and ground rolls movable relatively to each other. These rolls serve for the accommodation of hard particles and the form to be coated, and for rolling the form between the two outer surfaces of the rolls. The to and fro movement for rolling the form takes place mechanically.

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JP2000237657	COATING EQUIPMENT
JPH05229270	METHOD FOR FORMING ADHESIVE PATTERN

WARUTA EBUNA

JP20748682A

July 27, 1983

November 26, 1982

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KASUPARU O HA MESUNA

B05D1/28; B23D61/18; B23D65/00; B23P5/00; B24D18/00; B05C1/04; C25D7/00; (IPC1-7): B05C1/04; B05D1/28; B23D65/00; C25D7/00

Masatake Shiga

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